FREMONT, CA: The global semiconductor packaging equipment market is predicted to grow at a CAGR of more than eight percent by 2020, reports Technavio.
The increasing adoption of IoT in the consumer electronics and automotive sectors will drive the demand for wireless devices, demanding a high level of integration. To cope with this, semiconductor manufacturers have started developing new designs to support multiple applications on a single platform leading to the purchase of new IC packaging equipment especially the die-level packaging equipment. The mounting demand for system-on-chip, application processors and basebands, which are integrated into mobile and consumer electronic devices, will create demand for die-level packaging equipment.
APAC is predicted to dominate the market accounting for more than 72 percent of the total market shares by 2020. Presence of several major foundries such as Taiwan Semiconductor Manufacturing, United Microelectronics, Samsung, and Semiconductor Manufacturing International is considered to be the driving factor behind this. APAC also has major OSATs such as ASE and STATS ChipPAC. Study shows that the utilization of semiconductor devices is the largest in APAC due to the presence of leading consumer electronics manufacturers such as Samsung, Sony, LG, Toshiba, and Panasonic. Moreover, major global companies such as Apple and HP also have their production facilities in the region.
With a couple of major semiconductor manufacturers such as GlobalFoundries and Intel, North America is forecast to stand second after APAC. The region also has high adoption rate of communication devices such as smartphones and phablets creating the need for semiconductor packaging systems. The growth rate of Europe semiconductor packaging equipment market is low compared to other regional segments, due to the presence of a lower number of semiconductor foundries and semiconductor IC manufacturers. Europe also has low concentration of electronic device manufacturers, reducing the need for semiconductor devices, and consequently for semiconductor manufacturing equipment. The semiconductor packaging equipment market in Europe was valued at USD 64.09 million in 2015.