APAC CIOOutlook

Advertise

with us

  • Technologies
      • Artificial Intelligence
      • Big Data
      • Blockchain
      • Cloud
      • Digital Transformation
      • Internet of Things
      • Low Code No Code
      • MarTech
      • Mobile Application
      • Security
      • Software Testing
      • Wireless
  • Industries
      • E-Commerce
      • Education
      • Logistics
      • Retail
      • Supply Chain
      • Travel and Hospitality
  • Platforms
      • Microsoft
      • Salesforce
      • SAP
  • Solutions
      • Business Intelligence
      • Cognitive
      • Contact Center
      • CRM
      • Cyber Security
      • Data Center
      • Gamification
      • Procurement
      • Smart City
      • Workflow
  • Home
  • CXO Insights
  • CIO Views
  • Vendors
  • News
  • Conferences
  • Whitepapers
  • Newsletter
  • Awards
Apac
  • Artificial Intelligence

    Big Data

    Blockchain

    Cloud

    Digital Transformation

    Internet of Things

    Low Code No Code

    MarTech

    Mobile Application

    Security

    Software Testing

    Wireless

  • E-Commerce

    Education

    Logistics

    Retail

    Supply Chain

    Travel and Hospitality

  • Microsoft

    Salesforce

    SAP

  • Business Intelligence

    Cognitive

    Contact Center

    CRM

    Cyber Security

    Data Center

    Gamification

    Procurement

    Smart City

    Workflow

Menu
    • Cyber Security
    • Hotel Management
    • Workflow
    • E-Commerce
    • Business Intelligence
    • MORE
    #

    Apac CIOOutlook Weekly Brief

    ×

    Be first to read the latest tech news, Industry Leader's Insights, and CIO interviews of medium and large enterprises exclusively from Apac CIOOutlook

    Subscribe

    loading

    THANK YOU FOR SUBSCRIBING

    MACOM Debuts Silicon Photonics Integrated Circuits for Datacenter Applications

    Macom’s L-PIC (Programmable Intelligent Computer) can have millions of virtual servers and can accommodate increased computing demands.  

    MACOM Debuts Silicon Photonics Integrated Circuits for Datacenter Applications

    By

    Apac CIOOutlook | Thursday, March 10, 2016

    Stay ahead of the industry with exclusive feature stories on the top companies, expert insights and the latest news delivered straight to your inbox. Subscribe today.

    LOWELL, MA: MACOM Technology Solutions, a provider of Next Generation Internet, High Performance RF, and photonic semiconductor devices– unveils new MAOP-L284CN L-PIC that integrates LASERS with silicon photonic integrated chips(IC’s) for a 100Gbps transmit solution for CWDM4(coarse wavelength-division-multiplexing) and CLR4(Fiber Interface for data transmission) applications.

    To overcome the data traffic by major internet providers, such as Amazon, Microsoft, Google and Facebook hyper-scale data centers are need to be built, which require high speed inter-connect solutions that are power efficient, compact and cost optimized. Macom’s L-PIC (Programmable Intelligent Computer) can have millions of virtual servers and can accommodate increased computing demands.

    L-PIC is built on MACOM’s Etched Facet Technology (EFT), lasers are attached to the Silicon PIC using its proprietary Self-Alignment process (SAEFT), which offers a power efficient solution at reduced manufacturing cost.

    MAOP-L284CN

    MAOP-L284CN features four high bandwidth Mach-Zehnder modulators integrated with four lasers (1270, 1290, 1310, and 1330 nm) and a CWDM (Coarse wavelength division mux) multiplexer, with each channel operating at up to 28 Gbps. The L-PIC operates on a standard single mode optical fiber, and includes integrated tap detectors for fiber alignment, system initialization and closed loop control. A single fiber aligned to the output edge coupler of this 4.1 x 6.5 mm die is the only optical requirement for implementing this device into QSFP28 transceiver applications. MACOM is also offering the MASC-37053A modulator driver integrated with CDR, matched with this L-PIC for optimized performance and power dissipation.

    “Silicon-based photonic integrated circuits, or PICs, enable integration of optical devices such as modulators and multiplexer onto a single chip. We believe that MACOM’s L-PIC solves the key challenge of aligning lasers to the silicon PIC with high yield and high coupling efficiency, making the adoption of Silicon PICs a reality for high-speed optical interconnects within the Datacenter,” says Vivek Rajgarhia, Vice President of Strategy, High-Speed Networking,MACOM.

    More in News

    AI's Role in Apac's Digital Transformation Journey

    AI's Role in Apac's Digital Transformation Journey

    Influence of AI on Supply Chain Management

    Influence of AI on Supply Chain Management

    Role of Blockchain in Fostering a Trust-Based Economy

    Role of Blockchain in Fostering a Trust-Based Economy

    Revolutionizing Healthcare Through 5G Technology

    Revolutionizing Healthcare Through 5G Technology

    I agree We use cookies on this website to enhance your user experience. By clicking any link on this page you are giving your consent for us to set cookies. More info

    Copyright © 2025 APAC CIOOutlook. All rights reserved. Registration on or use of this site constitutes acceptance of our Terms of Use and Privacy and Anti Spam Policy 

    Home |  CXO Insights |   Whitepapers |   Subscribe |   Conferences |   Sitemaps |   About us |   Advertise with us |   Editorial Policy |   Feedback Policy |  

    follow on linkedinfollow on twitter follow on rss
    This content is copyright protected

    However, if you would like to share the information in this article, you may use the link below:

    https://www.apacciooutlook.com/news/macom-debuts-silicon-photonics-integrated-circuits-for-datacenter-applications-nwid-1264.html