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MOLEX Announces Circuit Interconnector for Extended Port Density and Speed
Nano-Pitch I/O 80-Circuit Interconnect System detachable joints connector ideal for SAS and PCI Express applications, including storage-to-controller, server-to-server, server-to-switch, switch-to-switch, and mobile/enterprise.
By
Apac CIOOutlook | Thursday, March 17, 2016
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LISLE, IL: MOLEX, a supplier of advanced electronic components and solutions, introduces a system of Nano-Pitch I/O 80-Circuit Interconnect System detachable joints connector ideal for SAS and PCI Express applications, including storage-to-controller, server-to-server, server-to-switch, switch-to-switch, and mobile/enterprise.
Nano-Pitch bids highest port density (number of high speed differential lanes) and speed of 25Gbps per lane. It is compatible with all versions of the SAS protocol, SATA and PCI (peripheral component interconnect). The solution is ideal for connections between the controller and storage, two servers, the server and the switch, two switches.
“With an industry-leading port density, multi-protocol application support, and enhanced signal integrity, the Nano-Pitch I/O80-Circuit Interconnect System is redefining PCIe and SAS solutions within the storage industry,” says Joe Dambach, Product Manager, MOLEX.
The new double-row connector is characterized by a high density layout. The system’s small form factor (5mm × 23mm × 9mm) and a 12mm mated connector-to-cable assembly height for right angle cable exit) allow it to service mobile devices through enterprise applications.
Flexible pin-out concept (continuous Ground-Signal-Signal-Ground) optimized for high-speed applications maximizes the number of high-speed lanes within the lengths provided.
Multi-protocol solution that adheres to a variety of industry standards designed into: T10/Serial Attached SCSI (The Small Computer System Interface, mini-Link (12 Gbps SAS-G3) roadmap to SAS-G4; SFF Committee/SFF-8611
Extremely small form factor design enables high speed and high bandwidth in connector services and mobile devices through enterprise applications.
Staggered, reliable and constant dual-row contact configuration allows for hot pluggability (the ability to add components without having to shut down the system)
Versatile metal shell housing provides an internal or external solution, with a low mated height that fits within the maximum component height of PCI.
