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Molex Announces New Innovative Solutions Targeting Optical Communications and Networking Applications
The MXC FlexiBend Cable Assemblies improve cable grooming with the ability to bend and direct fiber in any direction in tight-space configurations, such as equipment cabinets with doors and high-density racks

By
Apac CIOOutlook | Thursday, April 07, 2016
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LISLE, IL: Molex, a provider of electrical and electronic manufacturing solutions, announces new products such as its MXC Optical Interconnect Solutions, MXC FlexiBend Flexible-Boot Cable Assemblies, and High-Density Multiport Optical EMI Shielding Adapters.
MXC Optical Interconnect Solution with Molex FlexiBend Boot Cable Assemblies:
Optical cable routing is becoming increasingly difficult for installers when working with hundreds of fibers in dense optical patch panels. The MXC FlexiBend Cable Assemblies solve this congestion problem and greatly improve cable grooming with the ability to bend and direct fiber in any direction intight-space configurations, such as equipment cabinets with doors and high-density racks.
The MXC Optical Interconnect using its Versabeam expanded MT technology, combined with FlexiBend boots –alleviate cable management issues. The boots are designed to allow cables to exit in varying positions, from 0 to 60°.
High-Density Multiport Optical EMI Shielding Adapters:
EMI shielding adapters address mechanical design requirements limiting Electromagnetic interference (EMI) and radio frequency interference (RFI) emissions from front panels or enclosures. Molex’s High-Density Multiport Optical EMI Shielding Adapters are constructed of either all die-cast housings or as a half die-cast, half polymer housing. Housings have an EMI gasket that seals the adapters to the panel.
The adapters increase shielding effectiveness while enhancing front panel aesthetics compared to traditional plastic adapters. The Molex LC and MPO panel mount EMI adapter solutions eliminate the need for EMI containment structures, resulting in reduced engineering time, increased board space and reduced manufacturing costs.