Super Micro's BigTwin Server to Buttress Cost & Power Efficiencies in Enterprises Environments
By apacciooutlook | Monday, December 03, 2018
SALT LAKE, UTAH: Super Micro announces the availability of new BigTwin server architecture with enhanced cost and power efficiencies. The new offering incorporates high efficiency and high-density power stick technology in data center, cloud, and enterprise environments.
The BigTwin server is built with 2U rackmount server available in either two or four node models. Both the nodes support 24 DIMM of ECC DDR4-2400MHz and up to 3TB of memory. It further enriches flexible networking with SIOM add-on cards with quad/dual 1GbE, quad/dual 10GbE/10G SFP+, dual 25G, 100G, FDR and EDR InfiniBand options, 6 hot-swap 2.5" NVMe / SAS3 / SATA3 drives, 2 PCI-E 3.0 x16 slots, M.2 and SATADOM, and DP Intel Xeon processor E5-2600 v4/v3 product families up to 165W and 200W.
Other Offerings of Super Micro
The “3U MicroBlade” is built with high density (0.2U) 196 Xeon E5-2600v4/v3 DP MicroBlade servers per 42Urack and enables higher scalability and feasibility. It can further incorporate a Chassis Management Module, and up to two 10G, 2.5G or 1GbE SDN switches in 3U.
The “1U 4 Pascal GPU solution” with NVLink supports Nvidia Tesla P100 SXM2 GPUs with NVLINK up to 80GB/s, dual Intel Xeon E5-2600v4/v3 processors, 3 PCI-e 3.0 x16 slots for high-speed networking cards with support for GPUDirect RDMA.
“SuperServer 4028GR-TR2(T) -4U server” supports up to 10 Nvidia Tesla P100 GPU cards under a single-root complex, dual Intel Xeon E5-2600v4/v3 processors, additional PCI-e 3.0 x16 slots for networking cards with RDMA support.
Super Micro’s “7U SuperBlade” supports Intel Xeon Processor E5-2600 v4 product family with reduced management and power consumption cost.
"Innovation is at the core of Supermicro product development and benefits the HPC community with first-to-market integration of advanced technology such as our 1U with four and 4U with eight Pascal P100 SXM2 GPUs or 4U with ten PCI-e GPU systems, hot-swap U.2 NVMe, upcoming fabric technologies like Red Rock Canyon and PCI-E switches, as well as new architecture designs like our new high-density BigTwin system design," said Charles Liang, President and CEO of Supermicro. "Our total end-to-end solutions offer exactly the best deployment options for supercomputing clusters, delivering maximum performance per watt, per square foot, and per dollar."